Published 16-Mar-2007

Abstract
Semiconductor devices emit heat during operation. The operating temperature of the device affects circuit performance and more importantly, device reliability. This is a significant issue for semiconductor test because if the temperature of the tester electronics cannot be stabilized to a target level, yield will decrease and repeatability will degrade. If the target level cannot be kept relatively low, then system reliability is significantly reduced.

Automated Test Equipment (ATE) systems employ cooling techniques based on either air or liquid cooling mediums. Liquid cooling systems offer greater temperature stability than air. The higher heat transfer efficiency of liquid cooling systems also means that ATE operating temperatures can be reduced. This leads to greater system reliability, reduced tester operating costs, improved throughput and protection of the investment in the tester. This paper explores the effects of temperature on semiconductor devices and evaluates the benefits of liquid cooling over air cooling in ATE systems.