Consumer Mixed Signal
For semiconductor designers and high volume manufacturers, the V93000 Consumer Mixed Signal Solution performs mixed signal tests in both wafer sort and final test across a broad range of consumer applications. It is designed to achieve the optimal balance among breadth of possible tests, throughput speed and low cost-of-test.
Sweeping changes in consumer electronic devices (e.g. MP3 players, mobile phones, laptops, portable entertainment devices and high definition TV/video) are shaping the broader semiconductor marketplace. As a direct consequence of both exploding sales and plummeting prices for such devices, SOC prices are dropping 30-40% per year. Manufacturers have no choice but to respond with ever-lower cost-of-test.
This trend parallels rapidly increasing SOC complexity, which creates testing challenges, such as the need to reveal "known good die" with new SiP and MCP packaging techniques. With new failure mechanisms created by greater use of nanometer geometries, cost-effective wafer-level testing has become more important for catching failures earlier in the manufacturing cycle. Meanwhile, side-by-side testing of performance analog and DC requires higher levels of accuracy. Embedded PMIC in portable devices require accurate DC.
Lastly, powerful marketplace forces directly influence what test equipment must deliver. Massive device volumes mandate multi-site testing in order to reduce cost-of-test, with total throughput benchmarks determined by time-to-market, a make-or-break factor for manufacturers.
In short, any serious ATE solution in this dynamic marketplace must be:
Learn more about Verigy's Consumer Mixed Signal solution.
Sweeping changes in consumer electronic devices (e.g. MP3 players, mobile phones, laptops, portable entertainment devices and high definition TV/video) are shaping the broader semiconductor marketplace. As a direct consequence of both exploding sales and plummeting prices for such devices, SOC prices are dropping 30-40% per year. Manufacturers have no choice but to respond with ever-lower cost-of-test.
This trend parallels rapidly increasing SOC complexity, which creates testing challenges, such as the need to reveal "known good die" with new SiP and MCP packaging techniques. With new failure mechanisms created by greater use of nanometer geometries, cost-effective wafer-level testing has become more important for catching failures earlier in the manufacturing cycle. Meanwhile, side-by-side testing of performance analog and DC requires higher levels of accuracy. Embedded PMIC in portable devices require accurate DC.
Lastly, powerful marketplace forces directly influence what test equipment must deliver. Massive device volumes mandate multi-site testing in order to reduce cost-of-test, with total throughput benchmarks determined by time-to-market, a make-or-break factor for manufacturers.
In short, any serious ATE solution in this dynamic marketplace must be:
- cost effective
- flexible enough to test any mix of SOC
- adaptable to new test technologies
- able to provide the accuracy to ensure minimum yield loss at package test and test data to subsequently make design and process improvements
Learn more about Verigy's Consumer Mixed Signal solution.
SITEMAP | PRIVACY STATEMENT | TERMS OF USE | CONTACT WEBMASTER | CONTACT VERIGY |
© VERIGY LTD. 2006-2009