V6000 WS

Scalable, Versatile, and Lowest Cost-of-Test Solution for Flash and DRAM Wafer Sort, With Patent-Pending Active Matrix Technology

The V6000 WS memory test system with new patent-pending Active Matrix technology delivers versatility, scalability and breakthrough cost-of-test (COT) that manufacturers need for both Flash and DRAM testing. The V6000 WS delivers the lowest COT in the industry through:
  • Highest parallelism
  • 300mm one touch-down DRAM, NOR and NAND test
  • Scalability in AC performance - 140, 280, 560 Mbps - and parallelism (up to 18K I/O pins + 4K PPS (programmable power supply))
  • Active Matrix improves yield with no compromise to signal integrity

The revolutionary Active Matrix both improves yield and reduces cost per pin by 50 percent compared to a traditional tester, by providing a driver and comparator for each pin, and maintaining signal integrity and isolation. It enables 300 mm one-touchdown probing on most devices.

With the simple installation of a new probecard, the V6000 WS can test either DRAM or Flash memory, allowing manufacturers to shift production volumes quickly and easily to meet market conditions and maximize profits.

The V6000 WS also uses low-cost, connectorless probe cards, and also has the ability to use different size probe cards (450mm or 560mm).

The V6000 WS interfaces to all major probers.

The V6000 utilizes the same operating system software, hardware and interface as the V6000e and V6000 FT, making test programs portable from engineering and characterization to wafer sort and final test.

The V6000 is water-cooled, requiring a smaller footprint than air-cooled systems.

The V6000 platform's scalability and versatility will allow manufacturers to extend the useful life of the tester through a series of upgrades, well into the future.

Revolutionary Active Matrix

With the V6000 test solutions, Verigy introduces Active Matrix, the innovative patent-pending technology that enables increased throughput through increased parallelism, and increased yield through significantly improved signal fidelity.

Four times the number of pins = four times the parallelism at half the cost per pin
  • Pin electronics are moved to the interface layer, located in a cost-optimized pin electronics ASIC to achieve up to 18K pins per system
  • Custom ASICs with drivers and comparators, produce four times the parallelism of traditional test solutions, at significantly lower costs (50 percent less per pin)
  • Matches or exceeds the parallelism of other testers, without the signal degradation caused by sharing pins or the yield loss caused by shorted pins on a shared channel

75 percent reduction in distance between the pin electronics and probe card improves signal fidelity and yield
  • Active Matrix ASIC enables close proximity to the probe card to provide optimal signal performance and parallel reads
  • Reduced capacitive load-to-drive helps to eliminate excessive guard banding caused by long tester transmission lines that don’t match real-world device environments

Product Overview acro_icon  60KB
V6000 Demo flash_icon  4,143KB




image of v6000ws
V6000 WS - Test both Flash and DRAM on a single tester!
 
Features & Benefits
Key Specifications
Components & Options


Feature Benefit
Active Matrix  

Breakthrough parallelism and COT, with up to 18K pins.

Active Matrix maintains high yields, by maintaining signal integrity and isolation
     

Performance options:
70 MHz / 140 Mbps
140 MHz / 280 Mbps
280 MHz / 560 Mbps

 

Flexibility and scalability in performance to meet future test requirements

     
300 mm 1 touchdown probing   Lower COT, higher throughput 
     
6th generation Tester-Per-Site™ architecture  

Delivers better throughput for a range of memory devices (Flash and DRAM) by providing independent APGs per site.

Expandable configurations for increased parallelism
     
Hardware and software compatibility throughout the V6000 platform   All test programs can be leveraged from the V6000e engineering work station to the WS and FT platforms
     
RA hardware assist   The ability to run Redundancy Analysis including scan in the background. Scalable RA processing capability.
     
Multiple probe card sizes   Can use a 450 or a 560 mm probe card as needed, depending on how the tester is configured
     

Prober compatibility

  Docks to all major probers



Specification Value
Test sites  

128 max (32 TSMs max)

     

Tester resources

 

18,432 I/0 pins, 2,048 DCV max

     
Power supply outputs   4096 Max 
     
Test frequency / Data Rate   280 MHz / 560 Mbps (+/- 30 ps)
140 MHz / 280 Mbps (+/- 400 ps)
70 MHz / 140 Mbps (+/- 1 ns)
     
ECR   Up to 64 Gigabits per Test Site Module
     
Applications   NAND, NOR, MCPs, DRAM, SRAM



  • V6000 WS tester (system bay and test head)
  • Wafer sort interface
  • ECR (Error Capture RAM) memory size options
  • 1 - 32 test site modules (576 pins each)
  • DRAM Background Redundancy Analyzer
  • Performance options up to 280 MHz / 560 Mbps