This paper will discuss the measurement challenges and considerations for known good die testing of an RF SOC (system on chip) device. It will explore the challenges of setting up the multi-site wafer probe card and assembly. It will then discuss factors taken into account when selecting a probe station, RF wafer probe card, and ATE (automatic test equipment) test system. The challenges of testing RF performance on-wafer are described.

In last month's issue of go/semi, the fundamentals of under-sampling were discussed. In this and subsequent issues, practical conditioning strategy of under-sampling is discussed in various applications. There are two types of analysis methods available. One is waveform analysis in the time domain, and the other is spectrum analysis in the frequency domain. In this issue, waveform analysis in the time domain is discussed.

In this paper, the basics of the IEEE 802.15.3a indoor operation standard will be described. The motivations for its use, and architectural comparisons to narrow band transceivers will be considered. Then, limitations to its omnipresence are visited, and finally, a thorough overview of the UWB modulation fundamentals is described.

There are a couple of different RF connectors available (like SMA or SMP) that I can use for RF projects, but which one provides the best RF performance?

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